Jet Etch automated acid decapsulation system is utilized to remove outer layers of high-density packages such as BGAs, multi-die BGAs, FPBGAs and chip scales to expose die markings, bond pads, bond wires and lead frame interconnects.
The entire die, along with its markings and manufacturer’s logo, will be examined by certified inspectors. A binocular metallurgical microscope with variable magnifications obtained through a suitable number of objectives in a turret threelens system is used for die photography after decapping or decapsulation. The decapsulation system is performed in accordance with MILSTD1580 or MILSTD 883.