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Solderability Testing

The solderability testing system provides anti-counterfeit detection of components through a number of procedures, including dip-and-look method and wetting balance analysis. 

The methods determine the solderability of device package terminations that will be joined to another surface using lead (PB) or PBfree solder attachments. During testing, NexGen Digital adheres to rigid industry standards, such as Mil and IPC/JEDEC.