We have the most rigorous test and inspection equipment to ensure security of the supply chain. In addition, we offer our staff training programs to ensure the inspection teams are armed with knowledge to surpass industry standards. NexGen Digital is one of the few AS6081, AS9120, ISO 90012015 and ANSI/ESD S20.20 – 2014 certified independent distributors in America. Member of ERAI and IDEA. IDEAICE3000 Certified Inspectors.
Qualified by Defense Logistics Agency Land and Maritime as Qualified Supplier List Of Distributors (QSLD) , and Qualified Testing Supplier (QTSL), Nexgen Digital is eligible to supply FSC 5961 and 5962 Military and commercial grade products to Department of Defense.
Registered International Traffic in Arms Regulations (ITAR)?
Decapsulation Jet Etch automated acid decapsulation system is utilized to remove outer layers of high density packages such as BGAs, multidie BGAs, FPBGAs and chip scales to expose die markings, bond pads, bond wires and lead frame interconnects.The entire die, along with its markings and manufacturer’s logo, will be examined by certified inspectors. A binocular metallurgical microscope with variable magnifications obtained througha suitable number of objectives in a turret threelens system is used for die photography after decapping or decapsulation.The decapsulation system is performed in accordance with MILSTD1580 or MILSTD 883.
Xray Inspection To further evaluate a parts authenticity, NexGen Digital uses Focal Spot Verifier for its defect detection and fundamental solder quality verification. Presence, condition of the die and wire bonds and cracks in epoxy are detectable with XRAY inspections. Through this process, NexGen Digital is able to identify inconsistent internals, the most common indicator of counterfeit products.
Solderability Testing The solderability testing system provides anticounterfeit detection of components through a number of procedures, including dipandlook method and wetting balance analysis. The methods determine the solderability of device package terminations that will be joined to another surface using lead (PB) or PBfree solder attachments. During testing, NexGen Digital adheres to rigid industry standards, such as Mil and IPC/JEDEC.
Tektronix Curve Tracer NexGen Digital uses highpowered Tektronix curve tracers to perform DC parametric characterization on a wide variety of power semiconductors including thyristors, SCRs, IGBTs and power MOSFETs to identify characterization of new designs, extraction of SPICE parameters, failure analysis and data sheet generation. In addition, Tektronix curve tracers can be used in manufacturing to verify device quality and process monitoring.
Visual Inspection Two different levels of microscopes, stereo microscope and a binocular metallurgical microscope, are used to perform a highmagnify visual inspection of parts. Under NexGen Digital’s Counterfeit Prevention, Detection and Control Plan parts go through a stepbystep inspection to eliminate any suspicion of refurbished and/or counterfeit parts.
Xrf Analysis XRAY fluorescence is performed to confirm the presence of any substances restricted under European Union’s Directive 200/95/EC and/ or absence of lead, where required.
Part Permanency / Resistance to Solvents A marking permanency test is performed by swabbing one part by volume of isopropyl alcohol, three parts by volume of mineral spirits per MilStd883 test method 2015 or JESDB107C. Acetone can be used to check for resurfacing and coatings on the parts. Scratch test is also used on the component surface with a scribe or blade to detect coating that is not detectable with acetone testing.
Baking and Dry Packing Moisture Sensitive Products are handled, packaged and stored according to the OEM’s moisture level specifications and IPC/JEDEC JSTD standards in an industrial convection oven. NexGen Digital utilizes vacuum sealing machinery and industry standard dry packaging material such as bags, humidity indicator cards and moisture absorbing desiccants.
Tape and Reel NexGen Digital is capable of handling variety of package types including SMT, axial and radial, from 8mm to 200mm wide and up to 25mm deep. All components are taped according to EIA standards.